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68764-436HLF

68764-436HLF

68764-436HLF

Amphenol ICC (FCI)

BERGSTIK® II Series 1-Row Header Solder Phosphor Bronze Bulk Through Hole, Right Angle Tin 36-Position Board to Board 0.095 2.41mm Height

SOT-23

68764-436HLF Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 8 Weeks
Contact Material Phosphor Bronze
Contact Plating Tin
Mount Through Hole
Mounting Type Through Hole, Right Angle
Contact Shape Square
Housing Material Thermoplastic
Packaging Bulk
Series BERGSTIK® II
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
Connector Type Header
Number of Positions 36
Max Operating Temperature 125°C
Min Operating Temperature -65°C
Color Black
Number of Rows 1
Gender Male
Voltage - Rated 1.5kV
Fastening Type Push-Pull
Contact Finish - Mating Tin
Contact Type Male Pin
Pitch 2.54mm
Orientation Right Angle
Depth 6.6mm
Insulation Height 0.095 2.41mm
Style Board to Board
Number of Positions Loaded All
Current Rating 3A
Pitch - Mating 0.100 2.54mm
Insulation Color Black
Contact Length - Post 0.120 3.05mm
Shrouding Unshrouded
Number of Contacts 36
Contact Finish - Post Tin
Contact Length - Mating 0.100 2.54mm
Contact Gender Male
Housing Color Black
Lead Length 3.05mm
Insulation Resistance 5GOhm
Max Voltage Rating (AC) 1.5kV
Mating Post Length 2.54mm
Length 91.44mm
Contact Finish Thickness - Mating 100.0μin 2.54μm
Material Flammability Rating UL94 V-0
RoHS Status RoHS Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
68764-436HLF Product Details

68764-436HLF Overview


A Header package is included with it.Its mounting type is Through Hole, Right Angle.Packaging is performed using a Bulk case.It is part of the BERGSTIK® II Series of products.Whenever it's below 125°C, it's best to use it.The device must operate at a temperature of -65°C at all times.Through Hole mounts the part.

68764-436HLF Features


BERGSTIK® II series


68764-436HLF Applications


There are a lot of Amphenol ICC (FCI)
68764-436HLF Rectangular Connectors applications.


  • Embedded systems
  • Datacom
  • Communication
  • Medical technology
  • Military Technology
  • Measuring & Control Technology
  • Instrumentation
  • Automotive Electronics
  • Telecommunications
  • Data Technology

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