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0010897503

0010897503

0010897503

Molex

C-Grid 70280 Series 2-Row Header, Breakaway Solder Copper Alloy Bulk Through Hole Gold Liquid Crystal Polymer (LCP), Glass Filled 50-Position Board to Board or Cable 0.090 2.29mm Height

SOT-23

0010897503 Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 8 Weeks
Contact Material Copper Alloy
Mounting Type Through Hole
Contact Shape Square
Insulation Material Liquid Crystal Polymer (LCP), Glass Filled
Packaging Bulk
Series C-Grid 70280
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
Connector Type Header, Breakaway
Number of Positions 50
Applications Automotive, General Purpose, Lighting, Medical, Telecommunications
Number of Rows 2
Fastening Type Push-Pull
Contact Finish - Mating Gold
Contact Type Male Pin
Insulation Height 0.090 2.29mm
Style Board to Board or Cable
Number of Positions Loaded All
Pitch - Mating 0.100 2.54mm
Insulation Color Black
Row Spacing - Mating 0.100 (2.54mm)
Contact Length - Post 0.110 2.79mm
Shrouding Unshrouded
Contact Finish - Post Tin
Contact Length - Mating 0.320 8.13mm
Overall Contact Length 0.520 13.21mm
Contact Finish Thickness - Mating 30.0μin 0.76μm
Contact Finish Thickness - Post 74.8μin 1.90μm
Material Flammability Rating UL94 V-0
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
0010897503 Product Details

0010897503 Overview


Packaging is Header, Breakaway.Through Hole is the mounting type.Packaging for the product is carried out via a Bulk case.As a product of the C-Grid 70280 Series, it can be found in this category.A possible application of the device would be Automotive, General Purpose, Lighting, Medical, Telecommunications.

0010897503 Features


C-Grid 70280 series


0010897503 Applications


There are a lot of Molex
0010897503 Rectangular Connectors applications.


  • Embedded systems
  • Datacom
  • Communication
  • Medical technology
  • Military Technology
  • Measuring & Control Technology
  • Instrumentation
  • Automotive Electronics
  • Telecommunications
  • Data Technology

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