LFE2-12E-7Q208C Overview

As part of the 208-BFQFP package, it is included. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. Having 131 I/Os makes data transfers more coherent. A fundamental building block is made up of 12000 logic elements/cells. It is powered from a supply voltage of 1.2V. An FPGA part from the Field Programmable Gate Arrays family. The Surface Mount-slot connector on the FPGA module can be connected to the development board. There is a 1.14V~1.26V-volt supply voltage required for the device to operate. The ECP2 Series is one of the types of FPGAs that belong to this type. Operating temperatures should be maintained within the 0°C~85°C TJ range at all times when the unit is in use. In order to make this device as versatile as possible, there are 131 different outputs included. There is an FPGA model contained in Tray in order to conserve space. There are a total of 208 terminations. As far as the RAM bits are concerned, this device offers you a total of 226304. Its base part number LFE2-12 can be used to find related parts. Fpga electronics is important that this FPGA module has a RAM si27.6kBe of 27.6kB in order to ensure that the program will run normally. The device is designed with 208 pins in total. The FPGA is built as an array of 1500 latches or CLBs. Providing the FPGA is mounted in Surface Mount as per the specifications of the IC, then it should work perfectly according to its specifications. With a 1.2V supply voltage, designers can fully utilize the flexibility of the device. This device has a pin count of 208 in fpga semiconductor. There is a memory of 30.6kB embedded in this FPGA module, which can be used for storing programs and data. As fast as 420MHz can be reached with this FPGA.

LFE2-12E-7Q208C Features

131 I/Os
Up to 226304 RAM bits
208 LABs/CLBs

LFE2-12E-7Q208C Applications

There are a lot of Lattice Semiconductor Corporation LFE2-12E-7Q208C FPGAs applications.

• Consumer Electronics
• Distributed Monetary Systems
• Radar and Sensors
• Digital signal processing
• Integrating multiple SPLDs
• Broadcast
• ASIC prototyping
• Development Boards and Shields for Microcontrollers
• Artificial intelligence (AI)
• Aerospace and Defense