AGLE600V2-FGG256 Overview

In the 256-LBGA package, you will find fpga chips. A total of 165 I/Os allow data to be transferred in a more coherent manner. In order to construct a fundamental building block, 13824 logic elements/cells are required. FPGA modules can be attached to development boards using a Surface Mount-connector. This device is powered by a 1.14V~1.575V battery. The FPGA belongs to the IGLOOe series of FPGAs, and it is one type of FPGA. As far as the operating temperature is concerned, it should be kept within 0°C~70°C TA when operating. Unlike other FPGA models, this one is contained in Tray for the sake of space saving. A device like this one offers 110592 RAM bits, which is a considerable amount of memory. Parts related to this part can be found using its base part number AGLE600. In order to make it work, 256 pins have been designed. According to its specifications, this FPGA will be able to work fantastically as long as it is mounted in Surface Mount. As a result of the design of this module, the maximum operating temperature reaches 70°C. Fpga electronics is recommended that the operating temperature be higher than 0°C. As a basic building block, fpga semiconductor consists of 600000 gates. There is a maximum supply voltage of 1.575V that is supported by this product. With a minimum supply voltage of 1.14V, it can operate. As far as the speed of this FPGA is concerned, it can get up to 892.86MHz. 256-FPBGA (17x17) stands for its supplier device package.

AGLE600V2-FGG256 Features

165 I/Os
Up to 110592 RAM bits
256 LABs/CLBs
70°C gates

AGLE600V2-FGG256 Applications

There are a lot of Microsemi Corporation AGLE600V2-FGG256 FPGAs applications.

• Random logic
• High Performance Computing
• Voice recognition
• Aircraft navigation
• Ecosystem
• Automation
• Data center hardware accelerators
• Automotive advanced driver assistance systems (ADAS)
• Aerospace and Defense
• Data Center