There is a 896-BGA package that includes this component. Fpga chips is programmed wFpga chipsh 620 I/Os for transferring data in a more coherent manner. Surface Mount-connectors can be used to attach this FPGA module to the development board. This device is powered by a 1.14V~1.575V battery. This is a type of FPGA that is part of the ProASIC3L series of FPGAs. Fpga chips is recommended that the operating temperature be kept wFpga chipshin the range 0°C~85°C TJ while the machine is operating. It is for space saving reasons that this FPGA model is contained in Tray. There are 516096 RAM bits that are available with this device. In order to find related parts, use the part number M1A3PE3000L as a base. The RAM si63kBe of this FPGA module reaches 63kB so as to guarantee the normal operation of the program during operation. There are 896 pins on this device. In my opinion, this FPGA could produce fantastic results if mounted in Surface Mount, provided that its specifications are followed. A 1.2V-volt supply allows designers to fully utilize its flexibility. In this module, 70°C is the maximum operating temperature at which fpga electronics can operate. 0°C should be higher than the operating temperature. There are 3000000 gates in its basic building block. A total of 75264 registers are used for storing and transferring data between them. A maximum voltage of 1.26V can be supplied to it. The device can function at a minimum voltage of 1.14V. There is a possibility that this FPGA will be able to reach a speed of 892.86MHz. A 25mA supply current is used for its operation. The supplier of the device package is 896-FBGA (31x31).
M1A3PE3000L-1FGG896 Features
620 I/Os Up to 516096 RAM bits 896 LABs/CLBs 70°C gates 75264 registers
M1A3PE3000L-1FGG896 Applications
There are a lot of Microsemi Corporation M1A3PE3000L-1FGG896 FPGAs applications.