VSC7108XVP-01 Overview

Saving board space is achieved with the 69-FBGA package.For packing, Tray is used.The mounting type is Surface Mount.There are 8 circuits in this telecom IC .Improved efficiency can be ensured when the supply voltage of 2.5V 3.3V is provided.A 0°C~110°C-temperature setting offers reliable performance.Telecom switching is mounted in the way of Surface Mount.

VSC7108XVP-01 Features

Available in the 69-FBGA package

VSC7108XVP-01 Applications

There are a lot of Microsemi Corporation VSC7108XVP-01 Telecom applications.

• ISDN Primary Rate Interface
• Digital Access Cross-connect System (DACs)
• E1 Rates PCM Line Interface
• Home Gateway
• Wireless Local Loop
• Multiplexers
• Add/Drop multiplexers (ADMs)
• Hybrid fiber coax (HFC)
• Multichannel DS1 Test Equipment
• Wireless local loop (WLL)