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M82170G13

M82170G13

M82170G13

NXP USA Inc.

ARM® Cortex®-A9 Microprocessor 672-BGA

SOT-23

M82170G13 Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Package / Case 672-BGA
Operating Temperature 0°C~70°C TA
Packaging Tray
Published 2014
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Speed 1.2GHz
Core Processor ARM® Cortex®-A9
Ethernet GbE (3)
Number of Cores/Bus Width 2 Core 32-Bit
RAM Controllers DDR3
USB USB 2.0 + PHY (1), USB 3.0 + PHY
Additional Interfaces I2C, I2S, SPI, UART
Security Features Secure Boot, TrustZone®
SATA SATA 3Gbps (2)
RoHS Status ROHS3 Compliant
M82170G13 Product Details

M82170G13 Overview


Shipping overseas is convenient thanks to the embedded microprocessor's packaging in 672-BGA. High reliability is achieved using advanced packaging method Tray. 2 Core 32-Bit cores/Bus width are present in the CPU. Identify the operating temperature around 0°C~70°C TA. The CPU is cored by a processor with a number of 0 cores. A total of DDR3 RAM controllers are used by this CPU. The microprocessor features interfaces I2C, I2S, SPI, UART for better service.

M82170G13 Features


ARM® Cortex®-A9 Core


M82170G13 Applications


There are a lot of NXP USA Inc.
M82170G13 Microprocessor applications.


  • Television
  • Heater/Fan
  • Calculator
  • Kindle
  • Christmas lights
  • 3D printers
  • Washing machine
  • Microwave ovens
  • Home appliances
  • Home video and audio

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