Shipping overseas is convenient thanks to the embedded microprocessor's packaging in 672-BGA. High reliability is achieved using advanced packaging method Tray. 2 Core 32-Bit cores/Bus width are present in the CPU. Identify the operating temperature around 0°C~70°C TA. The CPU is cored by a processor with a number of 0 cores. A total of DDR3 RAM controllers are used by this CPU. The microprocessor features interfaces I2C, I2S, SPI, UART for better service.
M82170G13 Features
ARM® Cortex®-A9 Core
M82170G13 Applications
There are a lot of NXP USA Inc. M82170G13 Microprocessor applications.