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802-10-008-30-001191

802-10-008-30-001191

802-10-008-30-001191

Preci-Dip

802 Series 2-Row Header Solder Brass Tube Surface Mount Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 8-Position Board to Board 0.110 2.79mm Height

SOT-23

802-10-008-30-001191 Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 10 Weeks
Contact Material Brass
Mount Surface Mount
Mounting Type Surface Mount
Contact Shape Circular
Insulation Material Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature -55°C~125°C
Packaging Tube
Series 802
Published 2012
Feature Pick and Place
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
Connector Type Header
Number of Positions 8
Number of Rows 2
Voltage - Rated 150VDC
Fastening Type Push-Pull
Contact Finish - Mating Gold
Contact Type Male Pin
Current Rating (Amps) 3A
Insulation Height 0.110 2.79mm
Style Board to Board
Number of Positions Loaded All
Pitch - Mating 0.100 2.54mm
Insulation Color Black
Row Spacing - Mating 0.100 (2.54mm)
Shrouding Unshrouded
Contact Length - Mating 0.191 4.85mm
Contact Finish Thickness - Mating 10.0μin 0.25μm
Contact Finish Thickness - Post 10.0μin 0.25μm
Material Flammability Rating UL94 V-0
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
550 $1.23725 $680.4875
802-10-008-30-001191 Product Details

802-10-008-30-001191 Overview


Packaging for this item is Header.There is a mounting type of Surface Mount for this device.It is necessary to use a Tube case for packaging the product.This product is part of the 802 Series.In many ways, its Pick and Place feature makes it more powerful.Surface Mount is used to mount the part.In this case, the device operates at -55°C~125°C Operating Temperature.

802-10-008-30-001191 Features


802 series


802-10-008-30-001191 Applications


There are a lot of Preci-Dip
802-10-008-30-001191 Rectangular Connectors applications.


  • Transportation
  • Embedded systems
  • Datacom
  • Communication
  • Medical technology
  • Military Technology
  • Measuring & Control Technology
  • Instrumentation
  • Automotive Electronics
  • Telecommunications

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