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MS27UT466T19B32PB

MS27UT466T19B32PB

MS27UT466T19B32PB

TECONNECTIVITYDEUTSCH

MS27UT466T19B32PB datasheet pdf and Backplanes product details from TECONNECTIVITYDEUTSCH stock available on our website

SOT-23

MS27UT466T19B32PB Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time -
Lifecycle Status 25 Weeks
Mount Press Fit, Through Hole
Mounting Type Surface Mount
Package / Case SOIC
Number of Pins 4
Operating Temperature -40°C ~ 110°C
Packaging Bulk
Pbfree Code -
Part Status Active
Moisture Sensitivity Level (MSL) Not Applicable
Number of Terminations 9
ECCN Code -
Temperature Coefficient -
Subcategory Other Sensors
Voltage - Supply -
Base Part Number Xbghs Jgfih
Output Voltage 68 V
Output Type Adjustable
Interface I2C, SPI
Termination Type SOLDER
Operating Supply Current 10 mA
Nominal Supply Current 10 mA
Output Current 70 mA
Max Supply Current 1 μA
Slew Rate 0.3V/μs
Architecture -
Amplifier Type OPERATIONAL AMPLIFIER

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