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XCKU115-3FLVA1517E

XCKU115-3FLVA1517E

XCKU115-3FLVA1517E

Xilinx Inc.

4.09mm mm FPGAs Kintex? UltraScale? Series 1517-BBGA, FCBGA 1mm mm

SOT-23

XCKU115-3FLVA1517E Datasheet

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In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 10 Weeks
Mounting Type Surface Mount
Package / Case 1517-BBGA, FCBGA
Surface Mount YES
Operating Temperature 0°C~100°C TJ
Packaging Bulk
Published 2012
Series Kintex® UltraScale™
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
ECCN Code 3A001.A.7.B
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Packing Method TRAY
Technology CMOS
Voltage - Supply 0.970V~1.030V
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1V
Terminal Pitch 1mm
[email protected] Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B1517
Number of Outputs 624
Qualification Status Not Qualified
Power Supplies 1V
Number of I/O 624
Number of Inputs 624
Organization 5520 CLBS
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 1451100
Total RAM Bits 77721600
Number of LABs/CLBs 82920
Number of CLBs 5520
Height Seated (Max) 4.09mm
Length 40mm
Width 40mm
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
XCKU115-3FLVA1517E Product Details

XCKU115-3FLVA1517E Overview


Fpga chips is supplied in the 1517-BBGA, FCBGA package. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. 624 I/Os are available for transferring data more efficiently. A fundamental building block consists of 1451100 logic elements/cells. It is powered from a supply voltage of 1V. The Field Programmable Gate Arrays family of FPGA parts includes this part. Surface Mount-connectors can be used to attach this FPGA module to the development board. Powered by a 0.970V~1.030V supply voltage, fpga chips is able to operate at high speeds. This is a type of FPGA that is part of the Kintex? UltraScale? series of FPGAs. Fpga chips is necessary to keep the operating temperature wFpga chipshin 0°C~100°C TJ when the device is operating. In this device, 624 outputs are incorporated in order to provide you with maximum flexibility. This FPGA model is contained in Bulk for space saving. The RAM bits that are offered by this fpga chips are 77721600. 82920 LABs/CLBs are integrated into this FPGA. The device runs on a 1V battery and requires no additional power supply to operate. CLBs are the building blocks of its architecture. As a result, most industrial design purposes can be accommodated by its TRAY packing method.

XCKU115-3FLVA1517E Features


624 I/Os
Up to 77721600 RAM bits

XCKU115-3FLVA1517E Applications


There are a lot of Xilinx Inc. XCKU115-3FLVA1517E FPGAs applications.

  • Automotive
  • Image processing
  • Telecommunication
  • Device controllers
  • Integrating multiple SPLDs
  • Wired Communications
  • Automotive driver's assistance
  • OpenCL
  • Embedded Vision
  • Computer hardware emulation

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