1.7mm mm FPGAs Virtex? Series 560-LBGA Exposed Pad, Metal 1.27mm mm 560
SOT-23
XCV600-6BG560C Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
560-LBGA Exposed Pad, Metal
Operating Temperature
0°C~85°C TJ
Packaging
Tray
Published
2000
Series
Virtex®
JESD-609 Code
e0
Pbfree Code
no
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
560
ECCN Code
3A991.D
Terminal Finish
Tin/Lead (Sn63Pb37)
HTS Code
8542.39.00.01
Subcategory
Field Programmable Gate Arrays
Technology
CMOS
Voltage - Supply
2.375V~2.625V
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
225
Supply Voltage
2.5V
Terminal Pitch
1.27mm
Reach Compliance Code
not_compliant
[email protected] Reflow Temperature-Max (s)
30
Base Part Number
XCV600
Pin Count
560
JESD-30 Code
S-PBGA-B560
Number of Outputs
404
Qualification Status
Not Qualified
Power Supplies
1.2/3.62.5V
Number of I/O
404
RAM Size
12kB
Clock Frequency
333MHz
Number of Inputs
404
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells
15552
Total RAM Bits
98304
Number of Gates
661111
Number of LABs/CLBs
3456
Combinatorial Delay of a CLB-Max
0.6 ns
Height Seated (Max)
1.7mm
Length
42.5mm
Width
42.5mm
RoHS Status
Non-RoHS Compliant
Lead Free
Contains Lead
Pricing & Ordering
Quantity
Unit Price
Ext. Price
1
$1180.85000
$1180.85
500
$1169.0415
$584520.75
1000
$1157.233
$1157233
1500
$1145.4245
$1718136.75
2000
$1133.616
$2267232
2500
$1121.8075
$2804518.75
XCV600-6BG560C Product Details
XCV600-6BG560C Overview
There is a 560-LBGA Exposed Pad, Metal package that includes this component. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. Fpga chips is programmed wFpga chipsh 404 I/Os for transferring data in a more coherent manner. Logic blocks consist of 15552 logic elements/cells. It is powered from a supply voltage of 2.5V. An FPGA part from the Field Programmable Gate Arrays family. Using a Surface Mount connector, you can mount this FPGA module on the development board. This device is powered by a 2.375V~2.625V battery. As part of the Virtex? series of FPGAs, it is a type of FPGA. As far as the operating temperature is concerned, it should be kept within 0°C~85°C TJ when operating. A total of 404 outputs are incorporated into this device. This FPGA model is contained in Tray for space saving. In total, the terminations of this piece are 560. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 98304 bFpga chipss. If you are looking for related parts, you can use the base part number XCV600 as a starting point. During the configuration of this FPGA module, the RAM si12kBe reaches 12kB to ensure that the program runs normally. A total of 3456 LABs/CLBs make up this FPGA array. In my opinion, this FPGA could produce fantastic results if mounted in Surface Mount, provided that its specifications are followed. The device runs on a 1.2/3.62.5V battery and requires no additional power supply to operate. Fpga semiconductor is made up of 661111 gates as fpga semiconductors basic building block. The device has a total of 560 pins on fpga semiconductor. It usually uses a 333MHz crystal.
XCV600-6BG560C Features
404 I/Os Up to 98304 RAM bits
XCV600-6BG560C Applications
There are a lot of Xilinx Inc. XCV600-6BG560C FPGAs applications.