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XCV600-6BG560C

XCV600-6BG560C

XCV600-6BG560C

Xilinx Inc.

1.7mm mm FPGAs Virtex? Series 560-LBGA Exposed Pad, Metal 1.27mm mm 560

SOT-23

XCV600-6BG560C Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 560-LBGA Exposed Pad, Metal
Operating Temperature 0°C~85°C TJ
Packaging Tray
Published 2000
Series Virtex®
JESD-609 Code e0
Pbfree Code no
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 560
ECCN Code 3A991.D
Terminal Finish Tin/Lead (Sn63Pb37)
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Voltage - Supply 2.375V~2.625V
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 225
Supply Voltage 2.5V
Terminal Pitch 1.27mm
Reach Compliance Code not_compliant
[email protected] Reflow Temperature-Max (s) 30
Base Part Number XCV600
Pin Count 560
JESD-30 Code S-PBGA-B560
Number of Outputs 404
Qualification Status Not Qualified
Power Supplies 1.2/3.62.5V
Number of I/O 404
RAM Size 12kB
Clock Frequency 333MHz
Number of Inputs 404
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 15552
Total RAM Bits 98304
Number of Gates 661111
Number of LABs/CLBs 3456
Combinatorial Delay of a CLB-Max 0.6 ns
Height Seated (Max) 1.7mm
Length 42.5mm
Width 42.5mm
RoHS Status Non-RoHS Compliant
Lead Free Contains Lead
Pricing & Ordering
Quantity Unit Price Ext. Price
1 $1180.85000 $1180.85
500 $1169.0415 $584520.75
1000 $1157.233 $1157233
1500 $1145.4245 $1718136.75
2000 $1133.616 $2267232
2500 $1121.8075 $2804518.75
XCV600-6BG560C Product Details

XCV600-6BG560C Overview


There is a 560-LBGA Exposed Pad, Metal package that includes this component. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. Fpga chips is programmed wFpga chipsh 404 I/Os for transferring data in a more coherent manner. Logic blocks consist of 15552 logic elements/cells. It is powered from a supply voltage of 2.5V. An FPGA part from the Field Programmable Gate Arrays family. Using a Surface Mount connector, you can mount this FPGA module on the development board. This device is powered by a 2.375V~2.625V battery. As part of the Virtex? series of FPGAs, it is a type of FPGA. As far as the operating temperature is concerned, it should be kept within 0°C~85°C TJ when operating. A total of 404 outputs are incorporated into this device. This FPGA model is contained in Tray for space saving. In total, the terminations of this piece are 560. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 98304 bFpga chipss. If you are looking for related parts, you can use the base part number XCV600 as a starting point. During the configuration of this FPGA module, the RAM si12kBe reaches 12kB to ensure that the program runs normally. A total of 3456 LABs/CLBs make up this FPGA array. In my opinion, this FPGA could produce fantastic results if mounted in Surface Mount, provided that its specifications are followed. The device runs on a 1.2/3.62.5V battery and requires no additional power supply to operate. Fpga semiconductor is made up of 661111 gates as fpga semiconductors basic building block. The device has a total of 560 pins on fpga semiconductor. It usually uses a 333MHz crystal.

XCV600-6BG560C Features


404 I/Os
Up to 98304 RAM bits

XCV600-6BG560C Applications


There are a lot of Xilinx Inc. XCV600-6BG560C FPGAs applications.

  • DO-254
  • Medical Applications
  • Scientific Instruments
  • Enterprise networking
  • Data center hardware accelerators
  • Video & Image Processing
  • Audio
  • Cryptography
  • Data Center
  • Data Mining

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