FPGAs Virtex? UltraScale+? Series 2104-BBGA, FCBGA
SOT-23
XCVU11P-3FLGC2104E Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
11 Weeks
Mounting Type
Surface Mount
Package / Case
2104-BBGA, FCBGA
Operating Temperature
0°C~100°C TJ
Packaging
Tray
Published
2013
Series
Virtex® UltraScale+™
Part Status
Active
HTS Code
8542.39.00.01
Voltage - Supply
0.873V~0.927V
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Reach Compliance Code
not_compliant
[email protected] Reflow Temperature-Max (s)
NOT SPECIFIED
Number of I/O
416
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells
2835000
Total RAM Bits
396150400
Number of LABs/CLBs
162000
RoHS Status
ROHS3 Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
XCVU11P-3FLGC2104E Product Details
XCVU11P-3FLGC2104E Overview
A 2104-BBGA, FCBGA package is provided with this component. There are FIELD PROGRAMMABLE GATE ARRAY transistors in this type of FPGA. 416 I/Os are available for transferring data more efficiently. The basic building blocks of logic contain 2835000 logic elements/cells. An attachment Surface Mount allows the FPGA module to be attached to the development board. Powered by a 0.873V~0.927V supply voltage, fpga chips is able to operate at high speeds. An FPGA belonging to the Virtex? UltraScale+? series is referred to as an FPGA. While operating, the operating temperature should be kept within a range of 0°C~100°C TJ. A model of this FPGA is contained in Tray for the purpose of saving space. This device has 396150400 RAM bits, which is the number of RAM bits that this device offers. 162000 LABs and CLBs are built into this FPGA.
XCVU11P-3FLGC2104E Features
416 I/Os Up to 396150400 RAM bits
XCVU11P-3FLGC2104E Applications
There are a lot of Xilinx Inc. XCVU11P-3FLGC2104E FPGAs applications.