FPGAs Virtex? UltraScale+? Series 2104-BBGA, FCBGA
SOT-23
XCVU13P-2FHGA2104I Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
11 Weeks
Mounting Type
Surface Mount
Package / Case
2104-BBGA, FCBGA
Operating Temperature
-40°C~100°C TJ
Packaging
Tray
Published
2013
Series
Virtex® UltraScale+™
Part Status
Active
Moisture Sensitivity Level (MSL)
4 (72 Hours)
HTS Code
8542.39.00.01
Voltage - Supply
0.825V~0.876V
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Reach Compliance Code
not_compliant
[email protected] Reflow Temperature-Max (s)
NOT SPECIFIED
Number of I/O
832
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells
3780000
Total RAM Bits
514867200
Number of LABs/CLBs
216000
RoHS Status
ROHS3 Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
XCVU13P-2FHGA2104I Product Details
XCVU13P-2FHGA2104I Overview
There are two packages that contain fpga chips: 2104-BBGA, FCBGA package and X package. The FIELD PROGRAMMABLE GATE ARRAY-series of FPGAs are composed of this type. The device has 832 I/O ports for more coherent data transfer. The basic building blocks of logic contain 3780000 logic elements/cells. An FPGA module can be attached to a development board with a Surface Mount-pin. A supply voltage of 0.825V~0.876V is needed in order for fpga chips to operate. It is a type of FPGA belonging to the Virtex? UltraScale+? seies. While operating, the operating temperature should be kept within a range of -40°C~100°C TJ. A model of this FPGA is contained in Tray for the purpose of saving space. This device has 514867200 RAM bits, which is the number of RAM bits that this device offers. Fpga electronics contains 216000 LABs/CLBs in an array.
XCVU13P-2FHGA2104I Features
832 I/Os Up to 514867200 RAM bits
XCVU13P-2FHGA2104I Applications
There are a lot of Xilinx Inc. XCVU13P-2FHGA2104I FPGAs applications.