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XCVU190-2FLGA2577E

XCVU190-2FLGA2577E

XCVU190-2FLGA2577E

Xilinx Inc.

950mV V 4.01mm mm FPGAs Virtex? UltraScale? Series 2577-BBGA, FCBGA 1mm mm

SOT-23

XCVU190-2FLGA2577E Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 10 Weeks
Contact Plating Copper, Silver, Tin
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 2577-BBGA, FCBGA
Operating Temperature 0°C~100°C TJ
Packaging Tray
Published 2013
Series Virtex® UltraScale™
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
ECCN Code 3A001.A.7.B
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Voltage - Supply 0.922V~0.979V
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 0.95V
Terminal Pitch 1mm
Reach Compliance Code not_compliant
[email protected] Reflow Temperature-Max (s) NOT SPECIFIED
Operating Supply Voltage 950mV
Number of I/O 448
RAM Size 16.6MB
Organization 1800 CLBS
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 2349900
Total RAM Bits 150937600
Number of LABs/CLBs 134280
Speed Grade 2
Number of Registers 2.14848e+06
Number of CLBs 1800
Height Seated (Max) 4.01mm
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
XCVU190-2FLGA2577E Product Details

XCVU190-2FLGA2577E Overview


There are two packages that contain fpga chips: 2577-BBGA, FCBGA package and X package. There are FIELD PROGRAMMABLE GATE ARRAY transistors in this type of FPGA. This device features 448 I/Os in order to transfer data in a more efficient manner. A fundamental building block consists of 2349900 logic elements/cells. In order for the device to operate, a supply voltage of 0.95V volts needs to be provided. With a Surface Mount connector, this FPGA module can be attached to the development board. This device is powered by a 0.922V~0.979V battery. FPGAs belonging to the Virtex? UltraScale? series are a type of FPGA that belong to the Virtex? UltraScale? series of FPGAs. During the operation of the system, the operating temperature should remain within the range of 0°C~100°C TJ. As a space-saving measure, this FPGA model is contained within Tray. This device has 150937600 RAM bits, which is the number of RAM bits that this device offers. For the program to work properly, the RAM si16.6MBe of this FPGA module must reach 16.6MB GB in order to ensure normal operation. Fpga electronics contains 134280 LABs/CLBs in an array. As long as this FPGA is mounted in Surface Mount, it should be able to function as it should in terms of its specifications, as well as its capabilities. Its flexibility can be fully utilized when operating with a 950mV supply voltage. Fpga semiconductor is important to note that the data is stored and transferred in 2.14848e+06 different registers. For its architecture, 1800 CLB modules are used.

XCVU190-2FLGA2577E Features


448 I/Os
Up to 150937600 RAM bits
2.14848e+06 registers

XCVU190-2FLGA2577E Applications


There are a lot of Xilinx Inc. XCVU190-2FLGA2577E FPGAs applications.

  • Artificial intelligence (AI)
  • Server Applications
  • Consumer Electronics
  • Security systems
  • Video & Image Processing
  • DO-254
  • Data Center
  • Computer hardware emulation
  • Automotive driver's assistance
  • Industrial IoT

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