XCVU33P-2FSVH2104E Overview

There are two packages that contain fpga chips: 2104-BBGA, FCBGA package and X package. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. 208 I/Os are available for transferring data more efficiently. A fundamental building block consists of 961800 logic elements/cells. This FPGA module can be attached to the development board with a Surface Mount. This device is powered by a 0.825V~0.876V battery. As part of the Virtex? UltraScale+? series of FPGAs, it is a type of FPGA. In order to ensure a safe and efficient operation, it is important to maintain a temperature within 0°C~100°C TJ at all times. As far as the RAM bits are concerned, this device offers you a total of 24746394. Fpga electronics contains 54960 LABs/CLBs in an array.

XCVU33P-2FSVH2104E Features

208 I/Os
Up to 24746394 RAM bits

XCVU33P-2FSVH2104E Applications

There are a lot of Xilinx Inc. XCVU33P-2FSVH2104E FPGAs applications.

• Automotive Applications
• Industrial,Medical and Scientific Instruments
• Data Center
• Broadcast
• Medical Electronics
• Defense Applications
• Software-defined radios
• Radar and Sensors
• Medical ultrasounds
• Scientific Instruments