XCVU45P-2FSVH2104E Overview

There are two packages that contain fpga chips: 2104-BBGA, FCBGA package and X package. A total of 416 I/Os allow data to be transferred in a more coherent manner. A fundamental building block is made up of 1906800 logic elements/cells. The Surface Mount-slot connector on the FPGA module can be connected to the development board. This device is powered by a 0.825V~0.876V battery. This is a type of FPGA that is part of the Virtex? UltraScale+? series of FPGAs. Operating temperatures should be maintained within the 0°C~100°C TJ range at all times when the unit is in use. Fpga electronics is worth mentioning that this device provides 49597645 bfpga electronics s of RAM. 108960 LABs and CLBs are built into this FPGA.

XCVU45P-2FSVH2104E Features

416 I/Os
Up to 49597645 RAM bits

XCVU45P-2FSVH2104E Applications

There are a lot of Xilinx Inc. XCVU45P-2FSVH2104E FPGAs applications.

• Electronic Warfare
• Medical ultrasounds
• Software-defined radio
• Consumer Electronics
• Secure Communication
• Automotive Applications
• Voice recognition
• DO-254
• ASIC prototyping
• Enterprise networking