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XCVU5P-1FLVB2104E

XCVU5P-1FLVB2104E

XCVU5P-1FLVB2104E

Xilinx Inc.

FPGAs Virtex? UltraScale+? Series 2104-BBGA, FCBGA

SOT-23

XCVU5P-1FLVB2104E Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 13 Weeks
Mounting Type Surface Mount
Package / Case 2104-BBGA, FCBGA
Operating Temperature 0°C~100°C TJ
Packaging Tray
Series Virtex® UltraScale+™
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
HTS Code 8542.39.00.01
Voltage - Supply 0.825V~0.876V
Peak Reflow Temperature (Cel) NOT SPECIFIED
[email protected] Reflow Temperature-Max (s) NOT SPECIFIED
Number of I/O 702
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 1313763
Total RAM Bits 190976000
Number of LABs/CLBs 75072
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
XCVU5P-1FLVB2104E Product Details

XCVU5P-1FLVB2104E Overview


The package that contains this software is called 2104-BBGA, FCBGA. An FPGA of this type is made up of FIELD PROGRAMMABLE GATE ARRAY gates. Fpga chips is programmed wFpga chipsh 702 I/Os for transferring data in a more coherent manner. To form a fundamental building block, there are 1313763 logic elements/cells. The Surface Mount-slot on the development board allows you to attach the FPGA module. In order to operate it, it requires a voltage supply of 0.825V~0.876V . It is a type of FPGA belonging to the Virtex? UltraScale+? seies. Fpga chips is important to maintain the operating temperature wFpga chipshin the range of 0°C~100°C TJ when operating the machine. In order to save space, this FPGA model has been contained in Tray. Fpga electronics is worth mentioning that this device provides 190976000 bfpga electronics s of RAM. An array of 75072 LABs/CLBs is built into the FPGA.

XCVU5P-1FLVB2104E Features


702 I/Os
Up to 190976000 RAM bits

XCVU5P-1FLVB2104E Applications


There are a lot of Xilinx Inc. XCVU5P-1FLVB2104E FPGAs applications.

  • Medical ultrasounds
  • Consumer Electronics
  • Image processing
  • Data Center
  • Bioinformatics
  • Telecommunication
  • Distributed Monetary Systems
  • Enterprise networking
  • Data center hardware accelerators
  • Embedded Vision

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