FPGAs Virtex? UltraScale+? Series 2577-BBGA, FCBGA
SOT-23
XCVU9P-L2FLGA2577E Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
13 Weeks
Mounting Type
Surface Mount
Package / Case
2577-BBGA, FCBGA
Operating Temperature
0°C~110°C TJ
Packaging
Tray
Published
2013
Series
Virtex® UltraScale+™
Part Status
Active
Moisture Sensitivity Level (MSL)
4 (72 Hours)
HTS Code
8542.39.00.01
Voltage - Supply
0.698V~0.742V
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Reach Compliance Code
not_compliant
[email protected] Reflow Temperature-Max (s)
NOT SPECIFIED
Number of I/O
448
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells
2586150
Total RAM Bits
391168000
Number of LABs/CLBs
147780
RoHS Status
ROHS3 Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
XCVU9P-L2FLGA2577E Product Details
XCVU9P-L2FLGA2577E Overview
This package is included in the 2577-BBGA, FCBGA package and is available for purchase. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. The I/Os are designed to facilitate a more coherent transfer of data. A fundamental building block consists of 2586150 logic elements/cells. Surface Mount-connectors can be used to attach this FPGA module to the development board. With a supply voltage of 0.698V~0.742V, this device operates with ease. It is a type of FPGA that belongs to the Virtex? UltraScale+? series of FPGAs. During the operation of the system, the operating temperature should remain within the range of 0°C~110°C TJ. As a space-saving measure, this FPGA model is contained within Tray. Having a RAM bit size of 391168000 means that this device will offer you a lot of memory. 147780 LABs/CLBs are integrated into this FPGA.
XCVU9P-L2FLGA2577E Features
448 I/Os Up to 391168000 RAM bits
XCVU9P-L2FLGA2577E Applications
There are a lot of Xilinx Inc. XCVU9P-L2FLGA2577E FPGAs applications.