228-7396-55-1902

new-10%

Manufacturer part number:228-7396-55-1902

Manufacturer:3M

Description:228-7396-55-1902 datasheet pdf and Sockets for ICs, Transistors product details from 3M stock available on our website

Case Package:SOT-23

Datasheet:228-7396-55-1902 Datasheet

RoHs Status:non-compliant

Name	Value
Type	Parameter
Factory Lead Time	8 Weeks
Contact Material	Copper
Contact Plating	Gold
Mount	Through Hole
Mounting Type	Through Hole
Package / Case	SOIC
Number of Pins	28
Housing Material	Polyethersulfone (PES), Glass Filled
Weight	453.59237g
Number of Positions or Pins (Grid)	28 (2 x 14)
Contact Material - Mating	Beryllium Copper
Contact Material - Post	Beryllium Copper
Operating Temperature	-55°C~150°C
Packaging	Bulk
Series	Textool™
Published	1998
Feature	Closed Frame
Part Status	Active
Moisture Sensitivity Level (MSL)	1 (Unlimited)
Termination	Solder
Connector Type	Socket
Type	SOIC
Number of Positions	28
Max Operating Temperature	150°C
Min Operating Temperature	-55°C
Number of Rows	2
Gender	Female
Contact Finish - Mating	Gold
Current Rating (Amps)	1A
Pitch	1.27mm
Orientation	Straight
Current Rating	1A
Lead Pitch	2.54mm
Number of Contacts	28
Contact Finish - Post	Gold
Insulation Resistance	1 TΩ
Row Spacing	1.27 mm
Termination Post Length	0.140 3.56mm
Contact Finish Thickness - Post	30.0μin 0.76μm
Material Flammability Rating	UL94 V-0
REACH SVHC	No SVHC
RoHS Status	RoHS Compliant
Flammability Rating	UL94 V-0
Lead Free	Lead Free