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MVU14-14R/SK

MVU14-14R/SK

MVU14-14R/SK

3M

MVU14-14R/SK datasheet pdf and Terminals - Ring Connectors product details from 3M stock available on our website

SOT-23

MVU14-14R/SK Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 3 Weeks
Contact MaterialCopper, ETP
Mounting Type Free Hanging (In-Line)
Weight 1.402054kg
Material - Insulation Vinyl
Body Material Copper
PackagingBulk
Series Scotchlok™
Published 2000
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Crimp
Color Blue
Depth 11.93mm
Contact Finish Tin
Wire Gauge14-16 AWG
Wire Gauge (Max) 16 AWG
Wire Gauge (Min) 14 AWG
Body Plating Tin
Insulation Diameter 0.170 (4.32mm)
Insulation Insulated
Terminal TypeCircular
Stud/Tab Size 1/4 Stud
Length 27.43mm
Thickness 0.030 0.76mm
Length - Overall 1.080 27.43mm
Width - Outer Edges 0.470 11.94mm
RoHS StatusRoHS Compliant
In-Stock:8311 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$0.54000$0.54
10$0.50400$5.04
25$0.45320$11.33
50$0.40300$20.15
100$0.38620$38.62
250$0.35260$88.15
500$0.33580$167.9

About MVU14-14R/SK

The MVU14-14R/SK from 3M is a high-performance microcontroller designed for a wide range of embedded applications. This component features MVU14-14R/SK datasheet pdf and Terminals - Ring Connectors product details from 3M stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the MVU14-14R/SK, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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