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3MABUT5020HF394X1055

3MABUT5020HF394X1055

3MABUT5020HF394X1055

3MTC

3MABUT5020HF394X1055 datasheet pdf and Batteries Non-Rechargeable (Primary) product details from 3MTC stock available on our website

SOT-23

3MABUT5020HF394X1055 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time -
Lifecycle Status 8 Weeks
Mount Flanges
Mounting Type Press Fit, Through Hole
Package / Case 8-SOIC (0.154, 3.90mm Width)
Number of Pins 4
Operating Temperature 0°C ~ 125°C
Packaging Tube
Pbfree Code -
Part Status Not For New Designs
Moisture Sensitivity Level (MSL) 1
Number of Terminations 9
ECCN Code EAR99
Temperature Coefficient POSITIVE ppm/°C
Subcategory Other Sensors/Transducers
Voltage - Supply -
Base Part Number Wctrj Ljeiqt
Output Voltage 95 V
Output Type N-Channel
Interface I2C, SPI
Termination Type -
Operating Supply Current -
Nominal Supply Current 700 μA
Output Current 40 mA
Max Supply Current 1 mA
Slew Rate -
Architecture VOLTAGE-FEEDBACK
Amplifier Type OPERATIONAL AMPLIFIER
In-Stock:4353 items

About 3MABUT5020HF394X1055

The 3MABUT5020HF394X1055 from 3MTC is a high-performance microcontroller designed for a wide range of embedded applications. This component features 3MABUT5020HF394X1055 datasheet pdf and Batteries Non-Rechargeable (Primary) product details from 3MTC stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 3MABUT5020HF394X1055, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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