AS4C16M16D1-5BIN Overview

A Volatile-type memory can be classified as the memory type of this device. In addition, memory ics is available in a Tray case as well. The case is embedded in 60-TFBGA. A memory chip with a capacity of 256Mb 16M x 16 is used on this device. DRAM-format memory is used in this device, which is a mainstream design. Due to its wide temperature range of -40°C~85°C TA, this device is well suited to a wide range of applications that require high performance. The device is capable of handling a supply voltage of 2.3V~2.7V. There is a recommendation that Surface Mount mounting type should be used for this product. The memory has a clock frequency rotation within 200MHz. This device must operate at a minimum temperature of -40°C. As a general rule, memory ics is recommended that the product be operated at temperatures no higher than 85°Cc, otherwise, damage could be done to it. Using this memory chip, you will be able to process data at a speed of 200MHz times per second.

AS4C16M16D1-5BIN Features

Package / Case: 60-TFBGA
Freguency at 200MHz
200MHz terminals

AS4C16M16D1-5BIN Applications

There are a lot of Alliance Memory, Inc. AS4C16M16D1-5BIN Memory applications.

• mainframes
• nonvolatile BIOS memory
• telecommunications
• workstations,
• cell phones
• embedded logic
• networks
• main computer memory
• Camcorders
• eDRAM