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AS4C256M8D2-25BCN

AS4C256M8D2-25BCN

AS4C256M8D2-25BCN

Alliance Memory, Inc.

Memory IC

SOT-23

AS4C256M8D2-25BCN Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 8 Weeks
Mounting Type Surface Mount
Package / Case 60-TFBGA
Supplier Device Package 60-FBGA (8x10)
Operating Temperature 0°C~95°C TC
Packaging Tray
Published 2014
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Max Operating Temperature 95°C
Min Operating Temperature 0°C
Technology SDRAM - DDR2
Voltage - Supply 1.7V~1.9V
Frequency 400MHz
Interface Parallel
Memory Size 2Gb 256M x 8
Memory Type Volatile
Clock Frequency 400MHz
Access Time 57.5ns
Memory Format DRAM
Memory Interface Parallel
Write Cycle Time - Word, Page 15ns
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
136 $9.56787 $1301.23032
272 $9.09449 $2473.70128
544 $9.00112 $4896.60928
1,088 $8.70108 $8.70108
AS4C256M8D2-25BCN Product Details

AS4C256M8D2-25BCN Overview


Volatile is the type of memory it has. There is a Tray case available. There is a 60-TFBGA case embedded in it. The memory size of the chip is 2Gb 256M x 8 Mb. There is a DRAM-format memory used in this device, which is the memory format used by mainstream devices. The device's extended operating temperature range of 0°C~95°C TC makes it ideal for many demanding applications. With 1.7V~1.9V as the supply voltage, it is capable of handling memory ics. Its recommended mounting type is Surface Mount. With a clock frequency of 400MHz, the memory rotates on its own. Memory ics must operate at a temperature of at least 0°C. It is recommended that operation of the part be restricted to temperatures not exceeding 95°C, otherwise damage to the part may occur as a result of overheating. Data is processed by this memory ics at a frequency of 400MHz.

AS4C256M8D2-25BCN Features


Package / Case: 60-TFBGA
Freguency at 400MHz
400MHz terminals

AS4C256M8D2-25BCN Applications


There are a lot of Alliance Memory, Inc. AS4C256M8D2-25BCN Memory applications.

  • servers
  • personal computers
  • hard disk drive (HDD)
  • printers
  • eSRAM
  • telecommunications
  • Cache memory
  • mainframes
  • data buffer
  • supercomputers

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