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5SGXEB6R2F43C3NES

5SGXEB6R2F43C3NES

5SGXEB6R2F43C3NES

Altera

850mV V FPGAs FBGA

SOT-23

5SGXEB6R2F43C3NES Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mount Surface Mount
Package / Case FBGA
Number of Pins 1760
Published 2015
Max Operating Temperature70°C
Min Operating Temperature 0°C
Operating Supply Voltage850mV
Number of I/O 600
Data Rate14.1 Gbps
Number of Logic Elements/Cells 597000
Number of Logic Blocks (LABs) 2660
Number of Transceivers 66
RoHS StatusRoHS Compliant
In-Stock:1888 items

5SGXEB6R2F43C3NES Product Details

5SGXEB6R2F43C3NES Overview


There are two packages that contain fpga chips: FBGA package and X package. Having 600 I/Os makes data transfers more coherent. Logic blocks consist of 597000 logic elements/cells. In this case, there are 1760 pins on the board. Having stated that, if this FPGA is mounted in Surface Mount, then it may be able to perform fantastically according to its specifications. The 850mV supply voltage provides designers with full flexibility in their designs. During its maximal operating temperature, this module reaches 70°C. In order to achieve 0°C, the operating temperature must be higher than 0°C. Fpga semiconductor consists of 2660 logic blocks (LABs). The high-speed signals from it are output using 66 transceivers.

5SGXEB6R2F43C3NES Features


600 I/Os
1760 LABs/CLBs
70°C gates
2660 logic blocks (LABs)


5SGXEB6R2F43C3NES Applications


There are a lot of Altera
5SGXEB6R2F43C3NES FPGAs applications.


  • Computer hardware emulation
  • Integrating multiple SPLDs
  • Voice recognition
  • Cryptography
  • Filtering and communication encoding
  • Aerospace and Defense
  • Medical Electronics
  • Audio
  • Automotive
  • Consumer Electronics

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