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95293-402-09LF

95293-402-09LF

95293-402-09LF

Amphenol ICC (FCI)

BERGSTIK® Series 1-Row Header, Breakaway Solder Phosphor Bronze Bulk Surface Mount Tin Thermoplastic 9-Position Board to Board 0.100 2.54mm Height

SOT-23

95293-402-09LF Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 8 Weeks
Contact Material Phosphor Bronze
Contact Plating Tin
Mount Surface Mount
Mounting Type Surface Mount
Contact Shape Square
Insulation Material Thermoplastic
Housing Material Thermoplastic
Packaging Bulk
Series BERGSTIK®
Published 2016
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
Connector Type Header, Breakaway
Number of Positions 9
Max Operating Temperature 125°C
Min Operating Temperature -65°C
Color Black
Number of Rows 1
Fastening Type Push-Pull
Contact Finish - Mating Tin
Contact Type Male Pin
Pitch 2.54mm
Orientation Straight
Depth 2.4mm
Insulation Height 0.100 2.54mm
Style Board to Board
Number of Positions Loaded All
Pitch - Mating 0.100 2.54mm
Insulation Color Black
Shrouding Unshrouded
Number of Contacts 9
Contact Finish - Post Tin
Contact Length - Mating 0.318 8.08mm
Housing Color Black
Max Voltage Rating (AC) 1.5kV
Length 22.86mm
Contact Finish Thickness - Mating 78.7μin 2.00μm
Contact Finish Thickness - Post 78.7μin 2.00μm
Material Flammability Rating UL94 V-0
RoHS Status RoHS Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
500 $0.71262 $356.31
95293-402-09LF Product Details

95293-402-09LF Overview


The packaging contains Header, Breakaway.There is a Surface Mount mounting type for the device.This product is packaged in a case marked Bulk.Product number BERGSTIK® belongs to the BERGSTIK® Series.Whenever the temperature is below 125°C, it's best.There is a minimum temperature requirement of [0°C] for this device.There is a Surface Mount mount on the part.

95293-402-09LF Features


BERGSTIK® series


95293-402-09LF Applications


There are a lot of Amphenol ICC (FCI)
95293-402-09LF Rectangular Connectors applications.


  • Embedded systems
  • Datacom
  • Communication
  • Medical technology
  • Military Technology
  • Measuring & Control Technology
  • Instrumentation
  • Automotive Electronics
  • Telecommunications
  • Data Technology

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