DILB32P-223TLF

new-10%

Manufacturer part number:DILB32P-223TLF

Manufacturer:Amphenol ICC (FCI)

Description:DILB32P-223TLF datasheet pdf and Sockets for ICs, Transistors product details from Amphenol ICC (FCI) stock available on our website

Case Package:SOT-23

Datasheet:DILB32P-223TLF Datasheet

RoHs Status:non-compliant

Name	Value
Type	Parameter
Factory Lead Time	11 Weeks
Contact Plating	Tin
Mount	Through Hole
Mounting Type	Through Hole
Insulation Material	Polyamide
Housing Material	Polyamide (PA), Nylon
Number of Positions or Pins (Grid)	32 (2 x 16)
Contact Material - Mating	Copper Alloy
Contact Material - Post	Copper Alloy
Operating Temperature	-55°C~125°C
Packaging	Tube
Series	DILB
Published	2006
Feature	Open Frame
Part Status	Active
Moisture Sensitivity Level (MSL)	1 (Unlimited)
Termination	Solder
Connector Type	DIP, Socket
Type	DIP, 0.6 (15.24mm) Row Spacing
Number of Positions	32
Max Operating Temperature	105°C
Min Operating Temperature	-55°C
Number of Rows	2
Contact Finish - Mating	Tin-Lead
Current Rating (Amps)	1A
Pitch	2.54mm
Orientation	Straight
Depth	17.78mm
Pitch - Mating	0.100 2.54mm
Voltage - Rated AC	200V
Number of Contacts	32
Contact Finish - Post	Tin-Lead
Contact Resistance	30mOhm
Insulation Resistance	1GOhm
Row Spacing	15.24 mm
Termination Post Length	0.124 3.15mm
Pitch - Post	0.100 2.54mm
Length	40.64mm
Contact Finish Thickness - Mating	100.0μin 2.54μm
Contact Finish Thickness - Post	100.0μin 2.54μm
Material Flammability Rating	UL94 V-0
REACH SVHC	No SVHC
Radiation Hardening	No
RoHS Status	RoHS Compliant