DIP318-011BLF

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Manufacturer part number:DIP318-011BLF

Manufacturer:Amphenol ICC (FCI)

Description:DIP318-011BLF datasheet pdf and Sockets for ICs, Transistors product details from Amphenol ICC (FCI) stock available on our website

Case Package:SOT-23

Datasheet:DIP318-011BLF Datasheet

RoHs Status:non-compliant

Name	Value
Type	Parameter
Contact Material	Copper
Mount	Through Hole
Mounting Type	Through Hole
Number of Pins	18
Housing Material	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Number of Positions or Pins (Grid)	18 (2 x 9)
Contact Material - Mating	Beryllium Copper
Contact Material - Post	Brass
Packaging	Tube
Published	2007
JESD-609 Code	e3
Feature	Open Frame
Part Status	Obsolete
Moisture Sensitivity Level (MSL)	1 (Unlimited)
Termination	Solder
ECCN Code	EAR99
Type	DIP, 0.3 (7.62mm) Row Spacing
HTS Code	8536.69.40.40
Contact Finish - Mating	Gold
Terminal Pitch	2.54mm
Pitch - Mating	0.100 2.54mm
Number of Contacts	18
Contact Finish - Post	Tin
PCB Contact Pattern	RECTANGULAR
Body Breadth	0.4 inch
Lead Length	3.175mm
Body Depth	0.165 inch
Contact Style	RND PIN-SKT
Mating Contact Pitch	0.1 inch
PCB Contact Row Spacing	0.3 mm
Termination Post Length	0.125 3.18mm
Pitch - Post	0.100 2.54mm
Height	4.19mm
Length	22.9mm
Width	10.2mm
Contact Finish Thickness - Mating	10.0μin 0.25μm
Contact Finish Thickness - Post	200.0μin 5.08μm
Material Flammability Rating	UL94 V-0
RoHS Status	RoHS Compliant
Flammability Rating	UL94 V-0