DIP328-011BLF

new-10%

Manufacturer part number:DIP328-011BLF

Manufacturer:Amphenol ICC (FCI)

Description:DIP328-011BLF datasheet pdf and Sockets for ICs, Transistors product details from Amphenol ICC (FCI) stock available on our website

Case Package:SOT-23

Datasheet:DIP328-011BLF Datasheet

RoHs Status:non-compliant

Name	Value
Type	Parameter
Contact Material	Copper
Mounting Type	Through Hole
Mount	Through Hole
Insulation Material	Polychlorinated
Housing Material	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Number of Positions or Pins (Grid)	28 (2 x 14)
Contact Material - Mating	Beryllium Copper
Contact Material - Post	Brass
Published	2007
Packaging	Tube
JESD-609 Code	e3
Feature	Open Frame
Part Status	Obsolete
Moisture Sensitivity Level (MSL)	1 (Unlimited)
Termination	Solder
ECCN Code	EAR99
Type	DIP, 0.3 (7.62mm) Row Spacing
Number of Rows	2
HTS Code	8536.69.40.40
Contact Finish - Mating	Gold
Orientation	Straight
Depth	10.16mm
Pitch - Mating	0.100 2.54mm
Number of Contacts	28
Contact Finish - Post	Tin
PCB Contact Pattern	RECTANGULAR
Body Breadth	0.4 inch
Lead Length	3.175mm
Contact Style	RND PIN-SKT
Row Spacing	7.62 mm
Mating Contact Pitch	0.1 inch
Termination Post Length	0.125 3.18mm
Pitch - Post	0.100 2.54mm
Width	10.2mm
Length	35.56mm
Contact Finish Thickness - Mating	10.0μin 0.25μm
Contact Finish Thickness - Post	200.0μin 5.08μm
RoHS Status	RoHS Compliant
Material Flammability Rating	UL94 V-0
Flammability Rating	UL94 V-0