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DIP328-014BLF

DIP328-014BLF

DIP328-014BLF

Amphenol ICC (FCI)

DIP328-014BLF datasheet pdf and Sockets for ICs, Transistors product details from Amphenol ICC (FCI) stock available on our website

SOT-23

DIP328-014BLF Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Contact Material Copper
Mount Through Hole
Mounting Type Through Hole
Number of Pins 28
Housing Material Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Number of Positions or Pins (Grid) 28 (2 x 14)
Contact Material - Mating Beryllium Copper
Contact Material - Post Brass
Packaging Tube
Published 2007
JESD-609 Code e3
Feature Open Frame
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
ECCN Code EAR99
Type DIP, 0.3 (7.62mm) Row Spacing
HTS Code 8536.69.40.40
Contact Finish - Mating Tin
Terminal Pitch 2.54mm
Pitch - Mating 0.100 2.54mm
Number of Contacts 28
PCB Contact Pattern RECTANGULAR
Body Breadth 0.4 inch
Lead Length 3.175mm
Body Depth 0.165 inch
Contact Style RND PIN-SKT
Mating Contact Pitch 0.1 inch
PCB Contact Row Spacing 0.3 mm
Termination Post Length 0.125 3.18mm
Pitch - Post 0.100 2.54mm
Height 4.19mm
Length 36.6mm
Width 10.2mm
Contact Finish Thickness - Mating 100.0μin 2.54μm
Contact Finish Thickness - Post 200.0μin 5.08μm
Material Flammability Rating UL94 V-0
RoHS Status RoHS Compliant
Flammability Rating UL94 V-0

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