SIP050-1X30-160BLF

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Manufacturer part number:SIP050-1X30-160BLF

Manufacturer:Amphenol ICC (FCI)

Description:SIP050-1X30-160BLF datasheet pdf and Sockets for ICs, Transistors product details from Amphenol ICC (FCI) stock available on our website

Case Package:SOT-23

Datasheet:SIP050-1X30-160BLF Datasheet

RoHs Status:non-compliant

Name	Value
Type	Parameter
Contact Material	Copper
Mount	Through Hole
Mounting Type	Through Hole
Number of Pins	30
Housing Material	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Number of Positions or Pins (Grid)	30 (1 x 30)
Contact Material - Mating	Beryllium Copper
Contact Material - Post	Brass
Packaging	Bulk
Series	SIP050-1x
Published	2007
JESD-609 Code	e4
Feature	Closed Frame
Part Status	Obsolete
Moisture Sensitivity Level (MSL)	1 (Unlimited)
Termination	Solder
ECCN Code	EAR99
Type	SIP
HTS Code	8536.69.40.40
Contact Finish - Mating	Gold
Pitch - Mating	0.100 2.54mm
Number of Contacts	30
Contact Finish - Post	Tin
PCB Contact Pattern	RECTANGULAR
Body Breadth	0.1 inch
Lead Length	2.413mm
Body Depth	0.095 inch
Contact Style	RND PIN-SKT
Mating Contact Pitch	0.1 inch
Termination Post Length	0.095 2.41mm
Pitch - Post	0.100 2.54mm
Height	2.41mm
Length	78.7mm
Width	2.54mm
Contact Finish Thickness - Mating	30.0μin 0.76μm
Contact Finish Thickness - Post	200.0μin 5.08μm
Material Flammability Rating	UL94 V-0
RoHS Status	RoHS Compliant
Flammability Rating	UL94 V-0