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ELFH04110

ELFH04110

ELFH04110

Amphenol PCD

Conn Shrouded Header HDR 4 POS 5mm Solder RA Thru-Hole

SOT-23

ELFH04110 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 8 Weeks
Contact MaterialBrass
Contact PlatingLead, Tin
Mount Through Hole
Mounting Type Through Hole
Housing Material Polybutylene Terephthalate (PBT)
Operating Temperature-40°C~105°C
PackagingTray
Published 2003
Series ELFH
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
ECCN Code EAR99
Type Header, Male Pins, Shrouded (4 Side)
Color Black
Number of Rows 1
Pitch 0.197 5.00mm
Orientation Right Angle
Depth 12.1mm
Insulation Height 0.319 8.10mm
Termination Style Solder
Voltage 300V
Max Current Rating 15A
Number of Levels 1
Current 15A
Number of Poles 4
Contact Mating Finish Tin
Number of Decks 1
Number of Ways 4
Safety Approval UL; VDE; CSA
Header Orientation 90°, Right Angle
Fastening Method CONNECTOR
Length 20mm
Material Flammability Rating UL94 V-0
Radiation HardeningNo
RoHS StatusRoHS Compliant
Lead Free Lead Free
In-Stock:7856 items

Pricing & Ordering

QuantityUnit PriceExt. Price
100$0.95000$95

About ELFH04110

The ELFH04110 from Amphenol PCD is a high-performance microcontroller designed for a wide range of embedded applications. This component features Conn Shrouded Header HDR 4 POS 5mm Solder RA Thru-Hole.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the ELFH04110, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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