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ESLM18100

ESLM18100

ESLM18100

Amphenol PCD

0.197 5.00mm Black Tray Polyamide (PA66), Nylon 6/6 Through Hole Horizontal with Board Screw - Rising Cage Clamp 1 Levels 14-30 AWG ESLM

SOT-23

ESLM18100 Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 8 Weeks
Contact Plating Tin
Mount Through Hole
Mounting Type Through Hole
Number of Pins 18
Housing Material Polyamide (PA66), Nylon 6/6
Contact Material - Plating Copper Alloy - Tin Plated
Clamp Material - Plating Copper Alloy - Nickel Plated
Screw Material - Plating Copper Alloy - Nickel Plated
Operating Temperature -40°C~110°C
Packaging Tray
Series ESLM
Published 2012
Feature Interlocking (Side)
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Screw
Max Operating Temperature 110°C
Min Operating Temperature -40°C
Color Black
Pitch 0.197 5.00mm
Wire Gauge 14-30 AWG
Voltage 300V
Number of Levels 1
Current 13.5A
Wire Gauge (Max) 30 AWG
Wire Gauge (Min) 14 AWG
Torque - Screw 0.5 Nm (4.4 Lb-In)
Positions Per Level 18
Mating Orientation Horizontal with Board
Wire Termination Screw - Rising Cage Clamp
Number of Positions Per Level 18
RoHS Status RoHS Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
100 $2.82900 $282.9
ESLM18100 Product Details

ESLM18100 Overview


Through Hole is the type of mounting for the device.To package the product, a Tray case is used.The product is a member of the ESLM Series.18 pins are present on the device.Use it when the temperature is below 110°C.Temperatures below -40°C are required for this device to operate.It is more powerful in many ways due to its Interlocking (Side) feature.It is mounted by Through Hole.It operates at an operating temperature of -40°C~110°C.

ESLM18100 Features


ESLM series


ESLM18100 Applications


There are a lot of Amphenol PCD
ESLM18100 Terminal Blocks applications.


  • Embedded systems
  • Datacom
  • Communication
  • Medical technology
  • Military Technology
  • Measuring & Control Technology
  • Instrumentation
  • Automotive Electronics
  • Telecommunications
  • Data Technology

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