625mW μW83 dB dBDACVoltage - BufferedSurface Mount R-2R R2 B B
SOT-23
AD669BR-REEL Datasheet
non-compliant
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Specifications
Name
Value
Type
Parameter
Contact Plating
Lead, Tin
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
28-SOIC (0.295, 7.50mm Width)
Number of Pins
28
Supplier Device Package
28-SOIC
Operating Temperature
-40°C~85°C
Packaging
Tape & Reel (TR)
Series
DACPORT®
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Max Operating Temperature
85°C
Min Operating Temperature
-40°C
Max Power Dissipation
625mW
Base Part Number
AD669
Output Type
Voltage - Buffered
Polarity
Bipolar, Unipolar
Number of Channels
1
Interface
Parallel
Number of Bits
16
Architecture
R-2R
Supply Type
Dual
Reference Type
External, Internal
Data Interface
Parallel
Differential Output
No
Resolution
2 B
Sampling Rate
167 ksps
Voltage - Supply, Analog
±13.5V~16.5V
Voltage - Supply, Digital
5V
Settling Time
13μs
Max Dual Supply Voltage
16.5V
Integral Nonlinearity (INL)
2 LSB
Min Dual Supply Voltage
13.5V
Dual Supply Voltage
15V
Number of Converters
1
Conversion Rate
167 ksps
INL/DNL (LSB)
±2 (Max), ±2 (Max)
Signal to Noise Ratio (SNR)
83 dB
Number of D/A Converters
1
Number of DAC Channels
1
RoHS Status
Non-RoHS Compliant
AD669BR-REEL Product Details
AD669BR-REEL Overview
There are two packages that contain it: 28-SOIC (0.295, 7.50mm Width) package and X package. By attaching the Surface Mount connector, you can use this FPGA module with your development board. FPGAs belonging to the DACPORT? series are a type of FPGA that belong to the DACPORT? series of FPGAs. Operating temperatures should be maintained within the -40°C~85°C range at all times when the unit is in use. This FPGA model is contained in Tape & Reel (TR) for space saving. AD669 is the base part number that can be used to identify related parts. There are 28 pins on this device. As long as this FPGA is mounted in Surface Mount, it should be able to function as it should in terms of its specifications, as well as its capabilities. A maximum operating temperature of 85°C can be reached by this module. There should be a temperature difference between -40°C and the operating temperature. Device package 28-SOIC is provided by its supplier.