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LTC1650ACN

LTC1650ACN

LTC1650ACN

Analog Devices, Inc.

DAC

SOT-23

LTC1650ACN Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mount Through Hole
Package / Case DIP
Max Operating Temperature70°C
Min Operating Temperature 0°C
Interface Serial
Power Dissipation-Max 50mW
Number of Bits 16
Supply Type Dual
Settling Time4 μs
Number of Converters 1
RoHS StatusRoHS Compliant
Lead Free Contains Lead
In-Stock:4818 items

LTC1650ACN Product Details

LTC1650ACN Overview


A DIP package is provided with this component. As long as this FPGA is mounted in Through Hole, it should be able to function as it should in terms of its specifications, as well as its capabilities. As far as the maximum operating temperature of this module is concerned, it reaches 70°C. Operating temperatures should exceed 0°C.

LTC1650ACN Features


DIP package


LTC1650ACN Applications


There are a lot of Analog Devices, Inc.
LTC1650ACN Digital to Analog Converters (DAC) applications.


  • Data Distribution System
  • Digital Potentiometer
  • Software Radio
  • Wireless infrastructure:
  • WCDMA, CDMA2000, TD-SCDMA, WiMAX
  • Wideband communications:
  • LMDS/MMDS, point-to-point
  • Instrumentation:
  • RF signal generators, arbitrary waveform generators
  • Mobile Communications

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