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LTC1650AIN

LTC1650AIN

LTC1650AIN

Analog Devices, Inc.

DAC

SOT-23

LTC1650AIN Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mount Through Hole
Package / Case DIP
Max Operating Temperature85°C
Min Operating Temperature -40°C
Interface Serial
Power Dissipation-Max 50mW
Number of Bits 16
Supply Type Dual
Settling Time4 μs
Number of Converters 1
RoHS StatusRoHS Compliant
Lead Free Contains Lead
In-Stock:2062 items

LTC1650AIN Product Details

LTC1650AIN Overview


A DIP package contains it, and it is available for download. Providing the FPGA is mounted in Through Hole as per the specifications of the IC, then it should work perfectly according to its specifications. A maximum operating temperature of 85°C can be reached by this module. Over -40°C should be the operating temperature.

LTC1650AIN Features


DIP package


LTC1650AIN Applications


There are a lot of Analog Devices, Inc.
LTC1650AIN Digital to Analog Converters (DAC) applications.


  • Software Radio
  • Wireless infrastructure:
  • WCDMA, CDMA2000, TD-SCDMA, WiMAX
  • Wideband communications:
  • LMDS/MMDS, point-to-point
  • Instrumentation:
  • RF signal generators, arbitrary waveform generators
  • Mobile Communications
  • Process Control and Industrial Automation
  • Automatic Test Equipment

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