The package that contains this software is called DIP. It is designed to maximiBulke space efficiency by containing the FPGA model in Bulk. In my opinion, this FPGA could produce fantastic results if mounted in Through Hole, provided that its specifications are followed. When this module is operated at its maximum operating temperature, it reaches 85°C. A higher operating temperature than -40°C is recommended.
LTC1655IN8 Features
DIP package
LTC1655IN8 Applications
There are a lot of Analog Devices, Inc. LTC1655IN8 Digital to Analog Converters (DAC) applications.