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LTC1657LIGN

LTC1657LIGN

LTC1657LIGN

Analog Devices, Inc.

DAC

SOT-23

LTC1657LIGN Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mount Surface Mount
Package / Case SSOP
PackagingBulk
Max Operating Temperature85°C
Min Operating Temperature -40°C
Interface Parallel
Power Dissipation-Max 3.25mW
Number of Bits 16
Supply Type Single
Settling Time20 μs
Number of Converters 1
RoHS StatusRoHS Compliant
Lead Free Contains Lead
In-Stock:4287 items

LTC1657LIGN Product Details

LTC1657LIGN Overview


The package that contains this software is called SSOP. It is designed to maximiBulke space efficiency by containing the FPGA model in Bulk. In my opinion, this FPGA could produce fantastic results if mounted in Surface Mount, provided that its specifications are followed. When this module is operated at its maximum operating temperature, it reaches 85°C. A higher operating temperature than -40°C is recommended.

LTC1657LIGN Features


SSOP package


LTC1657LIGN Applications


There are a lot of Analog Devices, Inc.
LTC1657LIGN Digital to Analog Converters (DAC) applications.


  • Calibration
  • Motor Control
  • Data Distribution System
  • Digital Potentiometer
  • Software Radio
  • Wireless infrastructure:
  • WCDMA, CDMA2000, TD-SCDMA, WiMAX
  • Wideband communications:
  • LMDS/MMDS, point-to-point
  • Instrumentation:

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