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LTC1666IG

LTC1666IG

LTC1666IG

Analog Devices, Inc.

DAC 1.5 B B

SOT-23

LTC1666IG Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Mount Surface Mount
Package / Case SSOP
Number of Pins 28
Packaging Bulk
Max Operating Temperature 85°C
Min Operating Temperature -40°C
Number of Channels 1
Interface Parallel
Power Dissipation-Max 180mW
Number of Bits 12
Supply Type Dual
Resolution 1.5 B
Sampling Rate 50 Msps
Settling Time 20 ns
Max Dual Supply Voltage 5.25V
Integral Nonlinearity (INL) 1 LSB
Min Dual Supply Voltage 4.75V
Dual Supply Voltage 5V
Number of Converters 1
RoHS Status RoHS Compliant
Lead Free Contains Lead
LTC1666IG Product Details

LTC1666IG Overview


There are two packages that contain it: SSOP package and X package. There is an FPGA model contained in Bulk in order to conserve space. In this case, there are 28 pins on the board. Having stated that, if this FPGA is mounted in Surface Mount, then it may be able to perform fantastically according to its specifications. During its maximal operating temperature, this module reaches 85°C. In order to achieve -40°C, the operating temperature must be higher than -40°C.

LTC1666IG Features


SSOP package
28 pins
1 channels


LTC1666IG Applications


There are a lot of Analog Devices, Inc.
LTC1666IG Digital to Analog Converters (DAC) applications.


  • Digital Potentiometer
  • Software Radio
  • Wireless infrastructure:
  • WCDMA, CDMA2000, TD-SCDMA, WiMAX
  • Wideband communications:
  • LMDS/MMDS, point-to-point
  • Instrumentation:
  • RF signal generators, arbitrary waveform generators
  • Mobile Communications
  • Process Control and Industrial Automation

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