Name	Value
Type	Parameter
Factory Lead Time	5 Weeks
Contact Material	Copper
Contact Plating	Gold, Tin
Mounting Type	Through Hole
Housing Material	Polyamide (PA46), Nylon 4/6, Glass Filled
Contact Material - Mating	Beryllium Copper
Contact Material - Post	Brass
Packaging	Bulk
Published	2006
Series	Correct-A-Chip® 1106396
JESD-609 Code	e3
Pbfree Code	yes
Part Status	Active
Moisture Sensitivity Level (MSL)	1 (Unlimited)
Termination	Solder
ECCN Code	EAR99
Number of Positions	28
Number of Rows	2
Additional Feature	SOCKET ADAPTER
Contact Finish - Mating	Gold
Current Rating (Amps)	3A
Pitch - Mating	0.100 2.54mm
Lead Pitch	2.54mm
Number of Contacts	28
Contact Finish - Post	Tin
PCB Contact Pattern	RECTANGULAR
Contact Style	RND PIN-SKT
Row Spacing	7.62 mm
Device Socket Type	IC SOCKET
Termination Post Length	0.130 3.30mm
Pitch - Post	0.100 2.54mm
Convert From (Adapter End)	DIP, 0.3 (7.62mm) Row Spacing
Convert To (Adapter End)	DIP, 0.6 (15.24mm) Row Spacing
Height	2.29mm
Length	35.6mm
Contact Finish Thickness - Mating	30.0μin 0.76μm
Contact Finish Thickness - Post	200.0μin 5.08μm
Material Flammability Rating	UL94 V-0
REACH SVHC	No SVHC
RoHS Status	ROHS3 Compliant
Lead Free	Lead Free

1106396-28

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