40-6554-11

new-10%

Manufacturer part number:40-6554-11

Manufacturer:Aries Electronics

Description:40-6554-11 datasheet pdf and Sockets for ICs, Transistors product details from Aries Electronics stock available on our website

Case Package:SOT-23

Datasheet:40-6554-11 Datasheet

RoHs Status:non-compliant

Name	Value
Type	Parameter
Factory Lead Time	4 Weeks
Contact Material	Copper
Mount	Through Hole
Mounting Type	Through Hole
Package / Case	DIP
Insulation Material	Polyphenylene
Housing Material	Polyphenylene Sulfide (PPS), Glass Filled
Number of Positions or Pins (Grid)	40 (2 x 20)
Contact Material - Mating	Beryllium Copper
Contact Material - Post	Beryllium Copper
Packaging	Bulk
Series	55
Published	2008
JESD-609 Code	e4
Feature	Closed Frame
Pbfree Code	yes
Part Status	Active
Moisture Sensitivity Level (MSL)	1 (Unlimited)
Termination	Solder
ECCN Code	EAR99
Type	DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing
Number of Positions	40
Max Operating Temperature	150°C
Min Operating Temperature	-55°C
Number of Rows	2
Gender	Female
Additional Feature	STANDARD: UL 94V-0
Contact Finish - Mating	Gold
Orientation	Straight
Depth	22.86mm
Current Rating	1A
Pitch - Mating	0.100 2.54mm
Voltage - Rated AC	1kV
Lead Pitch	2.54mm
Number of Contacts	40
PCB Contact Pattern	RECTANGULAR
Body Breadth	0.9 inch
Contact Style	BELLOWED TYPE
Insulation Resistance	1GOhm
Row Spacing	15.24 mm
Mating Contact Pitch	0.1 inch
Max Voltage Rating (AC)	1kV
Max Current Rating	1A
Dielectric Withstanding Voltage	1000VAC V
Termination Post Length	0.110 2.78mm
Pitch - Post	0.100 2.54mm
Height	11.94mm
Length	65.79mm
Width	22.9mm
Material Flammability Rating	UL94 V-0
REACH SVHC	No SVHC
RoHS Status	ROHS3 Compliant
Flammability Rating	UL94 V-0
Lead Free	Lead Free