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A-TB762-OQ04CV

A-TB762-OQ04CV

A-TB762-OQ04CV

Assmann WSW Components

Connector Headers With Brass Solid Pin Material Solder Through Hole

SOT-23

A-TB762-OQ04CV Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 23 Weeks
Mount Through Hole
Mounting Type Through Hole
Housing Material Polybutylene Terephthalate (PBT)
PackagingBulk
Published 2009
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Type Header, Male Pins, Shrouded (4 Side)
Number of Positions 4
Pitch 0.300 7.62mm
Termination Style Solder
Number of Levels 1
Current 10A
Header Orientation Vertical
Material Flammability Rating UL94 V-0
RoHS StatusROHS3 Compliant
In-Stock:32652 items

Pricing & Ordering

QuantityUnit PriceExt. Price

About A-TB762-OQ04CV

The A-TB762-OQ04CV from Assmann WSW Components is a high-performance microcontroller designed for a wide range of embedded applications. This component features Connector Headers With Brass Solid Pin Material Solder Through Hole.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the A-TB762-OQ04CV, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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