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T2117-TAQY

T2117-TAQY

T2117-TAQY

Atmel (Microchip Technology)

Hot Swap Controllers SO

SOT-23

T2117-TAQY Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Mount Surface Mount
Package / Case SO
Number of Pins 8
JESD-609 Code e3
Pbfree Code yes
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 8
ECCN Code EAR99
Terminal Finish Matte Tin (Sn)
Max Operating Temperature 100°C
Min Operating Temperature 0°C
Terminal Position DUAL
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Number of Functions 1
Reach Compliance Code unknown
Time@Peak Reflow Temperature-Max (s) 40
Pin Count 8
Number of Outputs 1
Qualification Status Not Qualified
Operating Supply Voltage 10V
Temperature Grade OTHER
Analog IC - Other Type ANALOG CIRCUIT
Power Dissipation-Max 400mW
Nominal Supply Current 500μA
Power Dissipation 400mW
Max Supply Current 500μA
Current - Output -100mA
Min Input Voltage 9V
Max Input Voltage 10V
Neg Supply Voltage-Nom (Vsup) -9.5V
Length 4.925mm
RoHS Status RoHS Compliant
Lead Free Lead Free
T2117-TAQY Product Details

T2117-TAQY Overview


You get it with the SO package.Hot-swappable device terminates wHot-swappable deviceh 8 in total.Device DUAL is in the terminal position.Total number of pins is 8.Operating the device requires 8 pins.There is a Surface Mount-axis orientation to it.Stable operation can be achieved with a maximum operating temperature of 100°C°C.Hot-swappable device operates at a minimum temperature of 0°C degrees Celsius in order to ensure reliabilHot-swappable devicey.An analog IC, ANALOG CIRCUIT in this instance, is used for this gadget.Hot Swap is defaulted to output 1.Hot Swap operates at a maximum current of 500μA.

T2117-TAQY Features


The terminal position of 8


T2117-TAQY Applications


There are a lot of Atmel (Microchip Technology)
T2117-TAQY hot swap controllers applications.


  • Electric vehicle
  • Avionics systems
  • Safe board insertion and extraction
  • Industrial computers and servers
  • Redundant-array-of-independent-disk (RAID) storage
  • Other forms of communications infrastructure
  • Board or blade insertion into live backplanes
  • Backplane
  • Loads
  • Distributed power systems

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