100-1221-3 datasheet pdf and Embedded - Microcontroller, Microprocessor, FPGA Modules product details from BECOM Systems GmbH stock available on our website
SOT-23
100-1221-3 Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Operating Temperature
0°C~70°C
Series
Blackfin®
Size / Dimension
1.44 x 1.24 36.5mmx31.5mm
Part Status
Active
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Connector Type
Expansion 2 x 60
Speed
600MHz
RAM Size
32MB
Core Processor
CM-BF537
Module/Board Type
MPU Core
Flash Size
4MB
RoHS Status
RoHS Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
1
$333.868981
$333.868981
10
$314.970737
$3149.70737
100
$297.142205
$29714.2205
500
$280.322834
$140161.417
1000
$264.455504
$264455.504
100-1221-3 Product Details
100-1221-3 Overview
A MPU Core module or board is used in the microcontroller.It has CM-BF537 cores and is driven by a processor.It is default for the microcontroller to set the mode to 0°C~70°C.Flash size on this MCU electronics is 4MB.In this case, the connector type is Expansion 2 x 60.I would say that MCU chip belongs to the Blackfin? Series.The RAM size has been reduced to 32MB in order to ensure that the software runs normally.In this case, the MCU chip operates at a 600MHz speed.
100-1221-3 Features
Core processor of CM-BF537 Flash size of 4MB Speed of 600MHz
100-1221-3 Applications
There are a lot of BECOM Systems GmbH 100-1221-3 Microcontroller, Microprocessor, FPGA Modules applications.