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83007 008100

83007 008100

83007 008100

Belden Inc.

Hook-up Wire 20AWG 1C TFE 100' SPOOL GRAY

SOT-23

83007 008100 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 4 Weeks
Insulation Material TFE
Conductor MaterialCopper, Silver Coated
Jacket (Insulation) Material Tetrafluoroethylene (TFE)
Operating Temperature-70°C~200°C
PackagingSpool
Published 2011
Series MIL-W-16878/4
Feature High Temperature
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Resistance 0.03Ohm
Shielding NO
Construction STRANDED
Number of Conductors 1
Approval Agency UL
Wire Gauge20 AWG
Voltage 600V
Connector Support Type WIRE AND CABLE
Cable TypeHook-Up
Jacket Color Gray
Conductor Strand19/32
Jacket (Insulation) Diameter 0.058 (1.47mm)
Rated Current 6.5A
Wire and Cable Name FLEXIBLE CORD AND FIXTURE WIRE
Length 100.0' 30.5m
Jacket (Insulation) Thickness 0.009 0.23mm
RoHS StatusROHS3 Compliant
Ratings UL Style 1213
In-Stock:96 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$85.10000$85.1
3$79.75333$239.25999
5$76.35000$381.75
10$72.45900$724.59
25$68.08240$1702.06
50$64.67840$3233.92
100$63.21930$6321.93

About 83007 008100

The 83007 008100 from Belden Inc. is a high-performance microcontroller designed for a wide range of embedded applications. This component features Hook-up Wire 20AWG 1C TFE 100' SPOOL GRAY.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 83007 008100, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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