GENERAL ATOMICS UHK17128 REVX2 Description

A practical, thermally conductive interface material is GAP PAD VO. The product is a filled, thermally conductive polymer that is delivered on a fiberglass carrier with a rubber coating for simple material handling. GAP PAD VO can fill up air gaps between PC boards and heat sinks or a metal chassis because of its conformable nature.

GENERAL ATOMICS UHK17128 REVX2 Features

• Thermal conductivity: 0.8 W/m-K

• Enhanced puncture, shear and tear resistance

• Conformable gap filling material

• Electrically isolating

GENERAL ATOMICS UHK17128 REVX2 Applications

• Telecommunications

• Computer and peripherals

• Power conversion

• Between heat-generating semiconductors and a heat sink

• Area where heat needs to be transferred to a frame, chassis, or other type of heat spreader

• Between heat-generating magnetic components and a heat sink