GF4000-00-240-50CC Description

BERGQUIST GAP FILLER TGF 4000 is a two-part, high thermal conductivity, liquid gap-filling material. The mixed system will cure at room temperature and can be accelerated with the addition of heat. BERGQUIST GAP FILLER TGF 4000 offers an extended working time to allow greater flexibility in the customer’s assembly process. Liquid-dispensed thermal materials offer infinite thickness variations and impart little to no stress on sensitive components during assembly. BERGQUIST GAP FILLER TGF 4000 exhibits low-level natural tack characteristics and is intended for use in applications where a strong structural bond is not required.

GF4000-00-240-50CC Features

Thermal Conductivity: 4.0 W/m-K

Extended working time for manufacturing flexibility

Ultra-conforming, with excellent wet-out

100% solids - no cure by-products

Excellent low and high-temperature mechanical and chemical stability

GF4000-00-240-50CC Applications

Automotive electronics (HEV, NEV, batteries)

Computer and peripherals

Between any heat-generating semiconductor and a heat sink

Telecommunications