CE201210-3N3J

new-10%

Manufacturer part number:CE201210-3N3J

Manufacturer:Bourns Inc.

Description:Ind Chip Multi-Layer 3.3nH 5% 100MHz 16Q-Factor Ceramic 300mA 0805 T/R

Case Package:SOT-23

Datasheet:CE201210-3N3J Datasheet

RoHs Status:non-compliant

Name	Value
Type	Parameter
Factory Lead Time	18 Weeks
Mount	Surface Mount
Mounting Type	Surface Mount
Package / Case	0805 (2012 Metric)
Terminal Shape	WRAPAROUND
Material - Core	Ceramic
Shape/Size Description	RECTANGULAR PACKAGE
Operating Temperature	-55°C~125°C
Packaging	Tape & Reel (TR)
Published	2008
Series	CE201210
Size / Dimension	0.079Lx0.049W 2.00mmx1.25mm
Tolerance	±5%
JESD-609 Code	e2
Pbfree Code	yes
Part Status	Active
Moisture Sensitivity Level (MSL)	1 (Unlimited)
Number of Terminations	2
Termination	SMD/SMT
ECCN Code	EAR99
Type	Multilayer
Terminal Finish	Silver/Nickel/Tin (Ag/Ni/Sn)
HTS Code	8504.50.80.00
Packing Method	TR, 7 Inch
Shielding	NO
Number of Functions	1
Depth	1.45mm
Construction	Rectangular
Current Rating	300mA
Military Standard	Not
Case Code (Metric)	2012
Case Code (Imperial)	0805
Inductance	3.3nH
Test Frequency	100MHz
DC Resistance (DCR)	130mOhm Max
Current	300mA
Max DC Current	300mA
Frequency - Self Resonant	4GHz
Inductor Application	RF INDUCTOR
Terminal Placement	DUAL ENDED
Q @ Freq	16 @ 100MHz
Q Factor	16
DC Current	300mA
Height	830μm
Height Seated (Max)	0.041 1.03mm
Radiation Hardening	No
RoHS Status	ROHS3 Compliant