CE201210-R18J

new-10%

Manufacturer part number:CE201210-R18J

Manufacturer:Bourns Inc.

Description:Ind Chip Multi-Layer 180nH 5% 50MHz 23Q-Factor Ceramic 300mA 0805 T/R

Case Package:SOT-23

Datasheet:CE201210-R18J Datasheet

RoHs Status:non-compliant

Name	Value
Type	Parameter
Factory Lead Time	18 Weeks
Mount	Surface Mount
Mounting Type	Surface Mount
Package / Case	0805 (2012 Metric)
Terminal Shape	WRAPAROUND
Weight	5.499807mg
Material - Core	Ceramic
Shape/Size Description	RECTANGULAR PACKAGE
Operating Temperature	-55°C~125°C
Packaging	Tape & Reel (TR)
Published	2012
Series	CE201210
Size / Dimension	0.079Lx0.049W 2.00mmx1.25mm
Tolerance	±5%
JESD-609 Code	e2
Pbfree Code	yes
Part Status	Active
Moisture Sensitivity Level (MSL)	1 (Unlimited)
Number of Terminations	2
Termination	SMD/SMT
ECCN Code	EAR99
Type	Multilayer
Terminal Finish	Silver/Nickel/Tin (Ag/Ni/Sn)
HTS Code	8504.50.80.00
Packing Method	TR, 7 Inch
Shielding	NO
Number of Functions	1
Depth	1.45mm
Construction	Rectangular
Current Rating	300mA
Military Standard	Not
Case Code (Metric)	2012
Case Code (Imperial)	0805
Inductance	180nH
Test Frequency	50MHz
DC Resistance (DCR)	1.1Ohm Max
Current	300mA
Max DC Current	300mA
Frequency - Self Resonant	400MHz
Inductor Application	RF INDUCTOR
Terminal Placement	DUAL ENDED
Q @ Freq	23 @ 100MHz
DC Current	300mA
Height	1mm
Height Seated (Max)	0.041 1.03mm
Radiation Hardening	No
RoHS Status	ROHS3 Compliant