PA0170

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Manufacturer part number:PA0170

Manufacturer:Chip Quik Inc.

Description:MINI SOIC-8 EXP PAD TO DIP-8 SMT

Case Package:SOT-23

Datasheet:PA0170 Datasheet

RoHs Status:non-compliant

Name	Value
Type	Parameter
Material	FR4 Epoxy Glass
Package Accepted	MiniSOIC EP
Published	2009
Series	Proto-Advantage
Size / Dimension	0.700 x 0.400 17.78mmx10.16mm
Part Status	Active
Moisture Sensitivity Level (MSL)	1 (Unlimited)
Number of Positions	8
Pitch	0.026 0.65mm
Proto Board Type	SMD to DIP
Board Thickness	0.062 1.57mm 1/16
RoHS Status	ROHS3 Compliant