PA0187

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Manufacturer part number:PA0187

Manufacturer:Chip Quik Inc.

Description:TO-263-9 DDPAK/D2PAK TO DIP-18 S

Case Package:SOT-23

Datasheet:PA0187 Datasheet

RoHs Status:non-compliant

Name	Value
Type	Parameter
Material	FR4 Epoxy Glass
Package Accepted	TO-263 (DDPAK/D2PAK)
Published	2009
Series	Proto-Advantage
Size / Dimension	0.700 x 1.000 17.78mmx25.40mm
Part Status	Active
Moisture Sensitivity Level (MSL)	1 (Unlimited)
Number of Positions	9
Pitch	0.038 0.97mm
Proto Board Type	SMD to DIP
Board Thickness	0.062 1.57mm 1/16
RoHS Status	ROHS3 Compliant